FIELD: assembly procedure for semiconductor devices. SUBSTANCE: embossed characters are used in aligning integrated circuit with photodetector to facilitate their viewing by operator in visualizing system; these characters are transparent for radiating light λ; embossed surface of characters is covered with reflecting coating; embossing depth α≥λ/4, and linear dimensions of embossed character are greater than radiation wavelength of light incident on substrate at angle α ≥ arctg a/2f,, where f is focal length of visualizing system; a is system lens diameter. EFFECT: improved quality of wiring. 3 dwg
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Authors
Dates
1998-11-10—Published
1996-01-31—Filed