FIELD: assembly procedure for semiconductor devices. SUBSTANCE: embossed characters are used in aligning integrated circuit with photodetector to facilitate their viewing by operator in visualizing system; these characters are transparent for radiating light λ; embossed surface of characters is covered with reflecting coating; embossing depth α≥λ/4, and linear dimensions of embossed character are greater than radiation wavelength of light incident on substrate at angle α ≥ arctg a/2f,, where f is focal length of visualizing system; a is system lens diameter. EFFECT: improved quality of wiring. 3 dwg
| Title | Year | Author | Number |
|---|---|---|---|
| METHOD OF SPECTRAL SELECTION OF OPTICAL RADIATION | 1996 |
|
RU2117920C1 |
| MULTICOMPONENT PHOTODETECTOR MANUFACTURING PROCESS | 1997 |
|
RU2137259C1 |
| DISPERSING DEVICE | 1996 |
|
RU2119150C1 |
| CADMIUM-MERCURY TELLURIDE SURFACE PASSIVATING TECHNIQUE | 1996 |
|
RU2156519C2 |
| INDEX SIGN AND ITS MANUFACTURING PROCESS | 1996 |
|
RU2118851C1 |
| OPTICOELECTRON DEVICE TO VISUALIZE IMAGE | 1992 |
|
RU2078349C1 |
| TRAVEL PICKUP | 1991 |
|
RU2008747C1 |
| MIRROR-AND-LENS SYSTEM | 1993 |
|
RU2089930C1 |
| DEVICE FOR POSITIONING OF OBJECTS | 1990 |
|
RU2011161C1 |
| HEAT DETECTOR | 1994 |
|
RU2097938C1 |
Authors
Dates
1998-11-10—Published
1996-01-31—Filed