METHOD OF MAKING COMPLEX-PROFILE ARTICLES WITH WIRE-GAUZE ENVELOPE Russian patent published in 1998 - IPC

FIELD: manufacture of complex-profile products with gauze envelope by high-temperature soldering process for operating in conditions of high temperature, high pressure, aggressive media and vibration. SUBSTANCE: method comprises steps of shaping envelope from web of wire gauze according to profile of article; treating trimmed wire ends of envelope in seam welding machine; applying on surface of framework to be soldered layer of copper with thickness 15-20 mm, on soldered surface of envelope - layer of nickel with thickness 15-20 micrometers; at assembling article tack welding ends of envelope in zone of their closing together by spot welding and pressing them to framework due to tack welding them in soldered zones by means of spot welding at spot diameter 3-5 mm and interspot spacing 5-10 mm. Soldering is realized in shield atmosphere at 1110-1130 C for 5-10 min. EFFECT: enhanced quality of soldered joint due to prevention of defects such as cracking and other, increased yielding.