FIELD: bank equipment. SUBSTANCE: device has plastic card which carries semiconductor microchip, which is connected to contact plates which are glued to plastic card by glue which consists of at least three layers. Middle layer of glue is made from flexible material. In preferable embodiment, contact plates are designed as parts of conducting frame. EFFECT: increased reliability. 8 cl, 4 dwg
| Title | Year | Author | Number |
|---|---|---|---|
| CARRYING FRAME | 1995 |
|
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| CARD HAVING BUILT-IN IC-CHIP AND SEMICONDUCTOR IC-CHIP USABLE WITH THE CARD | 1997 |
|
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| INTEGRATED-CIRCUIT MODULE AND ITS MANUFACTURING PROCESS | 1997 |
|
RU2165660C2 |
