FIELD: microelectronics. SUBSTANCE: module has terminal assembly with several mainly planar isolated contact members made of electricity conducting material and at least one semiconductor integrated circuit with one or more semiconductor integrators electrically connected through terminal leads to contact members of terminal assembly. Contact members of integrated-circuit module are formed by pre-fabricated system medium (terminal frame) for supporting at least one semiconductor integrated circuit and leads arranged in rows on at least two opposite sides of module and brought outside for surface wiring of integrated-circuit module on wiring surface of external printed-circuit board, that is, on its substrate. As a result, integrated-circuit module primarily designed for use in card with built-in microprocessor can be additionally modified for using on external board. EFFECT: reduced cost of logistics, wiring, storage, and transportation. 22 cl, 21 dwg
