INTEGRATED CIRCUIT MODULE Russian patent published in 2001 - IPC

Abstract RU 2173476 C2

FIELD: integrated circuits. SUBSTANCE: module has many microwelding holes their quantity being greater than that of chip leads; several microwelding holes relate to each contact member; one of these microwelding holes passes flexible wire lead to contact member. Proposed module can be easily built in any device incorporating semiconductor chips. EFFECT: enlarged functional capabilities. 11 cl, 3 dwg

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RU 2 173 476 C2

Authors

Khuber Mikhel'

Shtampka Peter

Dates

2001-09-10—Published

1996-10-28—Filed