FIELD: computer engineering. SUBSTANCE: method involves arranging of several turns of wire, thermal compression connection of wire terminals to first and second contact pads of semiconductor microchip, and mounting coil turns, which provide antenna coil, and semiconductor microchip on carrier. Goal of invention is achieved by using thermal compression welding unit, which is embedded directly into pointing head of turning apparatus, for thermal compression connection. Said pointing head arranges wire in several turns after connection of wire end to first contact pad of semiconductor microchip by means of thermal compression welding unit. Then, wire is connected to second contact pad of semiconductor microchip. EFFECT: simplified design, decreased cost and facilitated automation of production. 2 cl, 1 dwg
| Title | Year | Author | Number |
|---|---|---|---|
| CARRYING FRAME | 1995 |
|
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|
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| CONTACTLESS INTEGRATED-CIRCUIT CARD | 1996 |
|
RU2189633C2 |
