FIELD: electronic engineering. SUBSTANCE: device has built-in IC chip, card body and a set of contact sites manufactured from electric conductive material electrically connected to contact leads attached in correspondence to electronic circuit produced on semiconductor substrate of IC chip. The contact sites are manufactured as structured coating on the surface facing the electronic circuit of the semiconductor CI chip surface circuit. The IC chip manufactured in combination with contact sites is inserted and fixed in receiving opening of the card body so that the contact sites are flush-mounted with external surface of the card. To reach enough high mechanical flexibility, silicon substrate thickness is preferably less than 100 mcm scale. EFFECT: simplified design; high stability to bending loads. 10 cl, 2 dwg
