METHOD FOR ENCAPSULATING ELECTRONIC-CIRCUIT COMPONENT IN CURING PLASTIC, PLASTIC-COVERED ELECTRONIC-CIRCUIT COMPONENTS MANUFACTURED BY THIS METHOD, AND MOLD USED FOR THE PURPOSE Russian patent published in 1999 - IPC

FIELD: manufacture of components for electronic circuits including integrated circuits. SUBSTANCE: component is placed in built-up mold and, prior to injecting material into it, film capable of separating from walls is fitted between component and walls; then plastic is injected into space between component and film. Novelty is that use is made of film covered with material on side facing the component that sticks better to injected encapsulating plastic which is still warm than to film and, so, it remains adhered to plastic cover when the latter is removed from mold upon cooling down. Plastic- covered electronic-circuit component produced by this method and mold implementing it are given in description of invention. EFFECT: facilitated procedures. 19 cl, 7 dwg