FIELD: electronic engineering. SUBSTANCE: method for encapsulating electronic components such as integrated circuits in sealing compounds includes at least the following stages: component to be encapsulated is placed in mold, encapsulating material heated to high temperature is introduced in space between mold and component to be encapsulated and cured; encapsulated component is removed from mold; encapsulating material has the following composition, percent by weight: thermoplastic material - 50-60; reactive solvent - 50- 40. Electronic component encapsulated by proposed method is described. EFFECT: reduced friability of compounds; provision for dispensing with their storage at low temperatures and with additional curing. 4 cl, 1 tbl, 1 ex
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