ELECTROLYTE FOR DEPOSITION OF ALLOY COPPER-MOLYBDENUM Russian patent published in 2000 - IPC

Abstract RU 2149928 C1

FIELD: electroplating, production of coats with high-corrosion resistance. SUBSTANCE: electrolyte for deposition of alloy copper-molybdenum includes copper nitrite, trilon B, molybdenum-acid ammonium and organic additive O-10 ( polyethylenglycol esters of high-molecular alkyphenols ) with certain proportion of components which makes it feasible to produce coats with high-corrosion resistance. EFFECT: deposition of coats of high-corrosion resistance. 1 tbl

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RU 2 149 928 C1

Authors

Povetkin V.V.

Dates

2000-05-27—Published

1999-02-23—Filed