ELECTROLYTE FOR DEPOSITION OF COPPER-LEAD ALLOY Russian patent published in 1997 - IPC

Abstract RU 2090661 C1

FIELD: electroplating, in particular, electrolytic deposition of copper-lead alloy. SUBSTANCE: electrolyte for deposition of copper-lead alloy contains, g/l: copper nitrate, 20-30; lead nitrate, 20-30; versene, 40-50; "ОП-10" 4.5-5.5. EFFECT: enhanced rust resistance of electroplating. 1 tbl

Similar patents RU2090661C1

Title	Year	Author	Number
ELECTROLYTE FOR DEPOSITING BISMUTH-LEAD ALLOY	1996	Povetkin V.V. Devjatkova O.V. Danchuk L.N.	RU2105830C1
ZINC-PLUMBUM ALLOY DEPOSITION ELECTROLYTE	1997	Povetkin V.V. Danchuk L.N.	RU2118671C1
ELECTROLYTE FOR DEPOSITION OF ALLOY COPPER-MOLYBDENUM	1999	Povetkin V.V.	RU2149928C1
ELECTROLYTE FOR DEPOSITION OF COPPER-CADMIUM ALLOY	1998	Povetkin V.V. Ivanova T.E. Vedernikova A.V.	RU2135645C1
ELECTROLYTE FOR DEPOSITION OF COPPER-ZINC ALLOY	1997	Povetkin V.V. Muslimov R.R.	RU2125127C1
ELECTROLYTE FOR DEPOSITION OF ZINC-ANTIMONY ALLOY	1999	Povetkin V.V. Danchuk L.N.	RU2156324C1
ELECTROLYTE FOR DEPOSITING COPPER-NICKEL ALLOY	1996	Povetkin V.V. Devjatkova O.V.	RU2106436C1
ELECTROLYTE FOR DEPOSITION OF COPPER-THALLIUM ALLOY	1999	Povetkin V.V. Ivanova T.E. Muslimova A.V.	RU2172361C2
ELECTROLYTE FOR DEPOSITION OF CADMIUM-ANTIMONY ALLOY	2002	Povetkin V.V. Skifskij S.V. Koreshkova E.V.	RU2236487C1
ELECTROLYTE FOR DEPOSITING COPPER-COBALT ALLOY	1996	Povetkin V.V. Devjatkova O.V.	RU2101395C1

RU 2 090 661 C1

Authors

Povetkin V.V.

Devjatkova O.V.

Zakharov M.S.

Dates

1997-09-20—Published

1995-11-29—Filed