METHOD FOR MANUFACTURING OF PRINTED CIRCUIT BOARDS Russian patent published in 2000 - IPC

FIELD: manufacturing of radio electronic equipment. SUBSTANCE: method involves drilling holes in dielectric blank, preparation of its surface, simultaneous deposition of copper layer of required height onto dielectric base and holes walls from gas phase using decomposition of first group carbonyl metal vapor, for example, Cu₂(CO)₆; CuCO; Cu(CO)₂; Cu(CO)₃, or others from group, depending on their chemical properties. Operation proceeds in vacuum under pressure of 0.1 torr or in hydrogen, nitrogen or argon. Said gases are used as carriers and are driven from vaporizer into reactor, which contains blanks of printed circuit boards. Deposition process involves sequence of operations: evaporation of primary first group carbonyl metal, which is heated to respective temperature, feeding vapors to heated blanks of printed circuit boards, which temperature provides thermal dissociation of vapors, absorption-desorption events on blanks of printed circuit boards, production of nuclei and development of coating until it reaches required height. EFFECT: improved quality and increased reliability of operations of printed circuit boards, decreased efforts and cost for their production.