METHOD OF PRINTED CIRCUIT BOARD MANUFACTURE FROM GAS PHASE Russian patent published in 2008 - IPC H05K3/00 

FIELD: physics.

SUBSTANCE: invention is related to method of printed circuit board manufacture with application of coating from gas phase with the help of deposition of metal carbides. Method includes deposition of metal onto dielectric base and walls of openings in printed circuit boards by means of metal vapour decomposition in vacuum of 1·10^-1 mm of mercury column or in hydrogen, nitrogen and argon, where gases are used as carriers and are transported from evaporator to reactor, in which printed circuit board blanks are located, to heated blanks of printed circuit boards, at the temperature of which thermal dissociation of vapours is carried out with deposition of metal that has required thickness. At that decomposition of metal vapours of such compounds as AgJ, AuCOCl, is performed with heating of initial material of up to 20-25°C and heating of printed circuit boards up to 120-150°C, and compounds of Al(C₄H₉)₃ - with heating of initial material up to 150-170°C, and coated blanks of printed circuit boards - up to 250-270°C.

EFFECT: higher corrosion resistance, wear resistance and strength of printed circuit boards.