METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS FOR LIGHT DIODES Russian patent published in 2013 - IPC H05K3/06 H05K3/22 

FIELD: electricity.

SUBSTANCE: in the method for manufacturing of printed circuit boards based on a photochemical method, the first drilling of process base holes is carried out, then on the base stock they form a current-conducting pattern of an electrical circuit in series by a method of photolithography using a layer of an alkali-developed photoresist, then the pattern of the printed circuit board is developed, ends and open areas are protected with an aluminium-liquid photoresist, and etching is carried out, afterwards they remove the alkali-developed photoresist, and a liquid soldering mask is applied, then a solder is applied, for instance, POS-63; the second drilling of structural holes is carried out; the stocks of the basic material of printed circuit boards are represented by a structure of copper-dielectric-aluminium, besides, the copper coat is designed to place power elements, for instance, light diodes; etching is carried out in the following composition: copper chloride dihydrate, ammonium chloride, hydrochloric acid in the amount of 50-135 g/l, 30-80 g/l, 50-60 g/l, accordingly, besides, the solution is corrected on the basis of analysis results.

EFFECT: higher heat emission of printed circuit boards for the possibility to apply power elements and integrated microchips in them, higher manufacturability of printed circuit board pattern making.