METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS Russian patent published in 2005 - IPC

FIELD: radio and electric engineering.

SUBSTANCE: method includes applying oxide dielectric film on heat-resistant board and making electric-conductive circuit imprint by photo-lithography method, after applying film, metallic film is applied with specific resistance ρ≤1 Ohm•sm with thickness 15-25 mcm, then protective, well-soldering, metal-resistant nickel or cobalt cover is applied with thickness 4-5 mcm, as dielectric oxide film chromium-oxide film of black color is used with thickness not less than 8 mcm with specific resistance ρ≥1x10⁹ Ohm•sm. In certain cases of method realization, applying said dielectric oxide and then metallic with specific resistance ρ≤1 Ohm•sm and protective metal-resistant well-soldering films is performed on both sides of heat-resilient board and onto inner surface of technological apertures; as heat-resilient board titan or copper, or aluminum plates are used, as metallic cover with specific resistance ρ≤1 Ohm•sm copper or aluminum, or molybdenum are precipitated.

EFFECT: higher efficiency.

4 cl, 4 ex