METHOD OF MANUFACTURING STRIP PLATE ON INSULATING SUBSTRATE Russian patent published in 2008 - IPC H05K3/02 H05K3/06 

Abstract RU 2338341 C2

FIELD: electric engineering.

SUBSTANCE: in available method of strip plate manufacture surface of plate insulating substrate is covered by means of successive evaporation in vacuum with three-layer coating that consists of sublayer of electroconductive adhesive, for instance, vanadium, on which copper layer is deposited, then protective layer of chrome, on the latter resistive mask is applied by means of photolithography from photoresist, which corresponds to the pattern of strip plate. By means of photolithography electric conductor strips are marked, technological grooves along their contour and fringe along at least one side of stock perimeter. On top of marked grooves and fringe resist is removed, and selective chemical etch removal of chrome layers is carried out, and on grooves additionally copper layer is removed with width sufficient for further application of protective layer on lateral sides of electric conductor strips, and this layer protects strips against damage in process of etch removal of chrome, copper and adhesive layers from spacing places. Then resist is removed from strips of electric conductors and spacing places, and spacing places, both on top and from the side of groove, are covered with photoresist, then protective layer of chrome is removed selectively from electric conductor strips. After that copper layer is grown by electrolytic method on electric conductor strips to nominal width. For this purpose direct current electrode is connected to copper layer of fringe, which is electrically connected to copper layer of electric conductor strips on plate by means of three-layer coating on spacing places and electroconductive adhesive sublayer in technological grooves. Then on copper layer of strips additionally copper ions are deposited from electrolyte until copper layer of nominal width is created on electric conductor strips, after that from all sides of strips buffer layer from nickel is deposited, and protective gold layer is deposited on the latter, and resist is removed on spacing places, and three-layer coating from chrome, copper and vanadium selective chemical etch removal is carried out, thus strip plate is formed.

EFFECT: higher quality of strip plates on insulating substrate.

5 cl, 6 dwg

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RU 2 338 341 C2

Authors

Krjuchatov Vladimir Ivanovich

Dates

2008-11-10Published

2006-12-28Filed