PACKAGING DEVICE FOR ELECTRONIC STRUCTURAL COMPONENTS Russian patent published in 2000 - IPC

Abstract RU 2153221 C2

FIELD: electronic engineering. SUBSTANCE: surface- acoustic-wave structural members are packaged by device having cap that covers structural components on substrate and is made in the form of substrate-deposited coating provided with receiving depressions in the region of structural components. EFFECT: provision for shielding structural components from conducting particles. 12 cl, 3 dwg

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RU 2 153 221 C2

Authors

Fjurbakher Bruno

Lupp Fridrikh

Pal' Vol'Fgang

Traush Gjunter

Dates

2000-07-20—Published

1995-05-02—Filed