FIELD: soldering of tube plate with tubes, mainly thin-wall tubes of refractory metals. SUBSTANCE: method for soldering thin-wall tubes with diameter values less than 1 mm operating at temperature up to 2000 C comprises steps of placing metered quantity of solder in the form of powdered chips around openings of tube plate; soldering assembled structure in vacuum 1x10-5 Hg mm; heating structure until temperature lower than temperature of start of solder melting by 30-40 C; performing seasoning for equalizing temperature values of plate and tubes; carrying out further heating until temperature of start of solder melting; visually monitoring occurrence of drops of melt solder and deenergizing furnace at occurring such drops; cooling in protective medium. EFFECT: enhanced corrosion resistance of soldered joints, elimination of distortion of thin-wall tubes at soldering.
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