METHOD FOR SOLDERING TELESCOPIC CONSTRUCTIONS Russian patent published in 2004 - IPC

FIELD: power machine engineering, namely soldering of telescopic structures having thin-wall inner and thick-wall outer parts. SUBSTANCE: thick-wall outer part is made of high-strength nickel-base alloy; thin-wall inner part is made of alloy with silver content up to 90%; before assembling structure applying onto soldered surface of outer part layer of nickel coating; subjecting soldered surface of inner part and solder to cathode electrochemical degreasing, etching and washing in water; assembling parts in thermal fixation apparatus and forcing parts one to another during heating process, soldering and cooling them; placing assembled pack into container; evacuating container until evacuation degree 1•10^-2 Hg mm and performing soldering; realizing heating in inert-gas atmosphere at isothermic soaking; after soldering cooling structure inside container in argon atmosphere until temperature 200 +-5C and then subjecting it to air cooling. EFFECT: less loss of yield due to elimination of porosity of soldered joints. 3 cl