TELESCOPIC STRUCTURE SOLDERING METHOD Russian patent published in 2000 - IPC

FIELD: mechanical engineering; soldering and brazing. SUBSTANCE: proposed invention can be used at soldering of rotors containing thick-walled inner and thin-walled outer rings and operating under thermal stress conditions. First protective nickel coating is applied to surfaces of both rings to be soldered. Assembling is carried out at preset interference. Heating to solder melting point is carried out maintaining difference in ring temperature satisfying definite relationship. When solder melting point is reached, articles are subjected to isothermic levelling holding to provide ring temperature difference not exceeding 40 C. This difference is maintained to soldering temperature. Soldering and cooling are carried out in shielding medium. EFFECT: improved quality of soldered joints. 2 ex