COMPOSITION FOR ELECTROCHEMICAL COPPER PLATING OF THROUGH HOLES OF PRINTED CIRCUIT BOARDS Russian patent published in 2024 - IPC C25D3/38 C25D7/00 H05K3/42 

FIELD: chemical or physical processes.

SUBSTANCE: invention relates to the technology of electrochemical copper plating of holes of printed circuit boards and can be used for production of multilayer printed circuit boards in electronic industry. Composition contains 60–150 g/l of copper sulphate 5-aqueous, 180–290 g/l of sulfuric acid, 0.06–0.17 g/l of sodium chloride, 0.2–1.0 g/l of polyethylene glycol 4,000, 0.003–0.006 g/l 2-diethylamino-3,6-dimethyl-9-phenylphenazonium-7-azo-4'-dimethylaniline chloride or 0.001–0.003 g/l polyethyleneimine Mw 25,000 g/mol, 0.003–0.006 g/l of 3,7-bis-dimethylaminophenothiazine chloride and 0.001–0.08 g/l of sodium 3-mercapto-1-propane sulphonate or 0.001–0.04 g/l of sodium bis-3-sulphopropyl disulphide, water up to 1 l.

EFFECT: enabling increase in the deposition rate, obtaining lustrous coatings and wider range of operating current densities.

1 cl, 2 dwg, 17 ex