METHOD OF MULTILAYER PRINTED CIRCUIT BOARD MANUFACTURING Russian patent published in 2016 - IPC H05K3/46 

FIELD: manufacturing technology.

SUBSTANCE: invention relates to production of multilayer printed circuit boards (MPB) with high density of elements arrangement and can be used in assembly of microchips with low pitch. Achieved by that MPB production method comprises MPB assembly forming MPB layers, into package is performed by layer-by-layer building up of every following layer through pad onto MPB base consisting of layers, which does not contain blind transition holes. At that, before following layer building up in printed circuit boards forming MPB layers, blind transition holes are made located directly under components leads contact sites, performing their metallization, conducting photoresist application using additional photomasks and producing auxiliary technological layer, performing blind transition holes refilling with copper and removal of photoresist, followed by excess copper mechanical removal, alignment of copper thickness over entire surface of printed circuit board, application of each layer layout pattern, after package assembly and pressing performing through transition metalized holes and MPB outer layers layout application.

EFFECT: lower interconnections density in MPB production.

1 cl, 7 dwg