FIELD: manufacture of microcircuit cards. SUBSTANCE: invention refers to process of manufacture of module of card with microcircuit that includes medium with first contact plane and semiconductor crystal and current- conducting connections between semiconductor crystal and first contact plane. In addition to first contact plane the other side of module of card with microcircuit has second contact plane which is electrically connected to semiconductor crystal. Second contact can be used, for instance, for provision of contact with inductance coil integrated in frame of card for contact-free transmission of data. Technical objective of invention lies in development of process of manufacture of module of card with microcircuit that makes it possible to connect antenna or any other aid to contact elements of card with microcircuit by simple and economic technique. In this case module manufactured by given process prevents effect of noises or manipulations with card on its leads-out in noticeable degree. EFFECT: manufacture of module of card with microcircuit preventing effect of noises or manipulations with card on its leads- out. 10 cl, 3 dwg
