CARD WITH BUILT-IN INTEGRATED CIRCUIT AND ITS MANUFACTURING PROCESS Russian patent published in 2001 - IPC

Abstract RU 2170457 C2

FIELD: electronics. SUBSTANCE: card has card package and coupling member provided with current- conducting tracks and contact leads. Semiconductor integrated circuit carries on its surface contact members for electrical connection of electronic circuit and contact leads of coupling member. Insulating- material medium is provided for supporting at least part of current- conducting tracks and coupling-member contact leads; this medium is provided with hole in vicinity of coupling-member contact leads for receiving semiconductor integrated circuit. EFFECT: enhanced reliability and service life. 19 cl, 2 dwg

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RU 2 170 457 C2

Authors

Fris Manfred

Janchek Tis

Dates

2001-07-10Published

1997-03-04Filed