FIELD: methods and devices for melting and heating of substances; applicable in pharmaceutics, food, chemical and other industries for melting of consistent substances including those with low heat conduction. SUBSTANCE: method includes installation of device for realization of claimed method on vessel with substance to be melted; setting of limiter for preset depth of immersion of melting frame; and switching-on of heating system. When melting frame is heated to temperature above melting point of said substance, device sinks into substance from atop, as it melts, along guides down to preset depth of immersion of melting frame. In so doing, temperature of surface in zone of contact with substance to be melted is maintained below point of substance destruction, and temperature on melt surface is maintained above substance melting point. Such technical solution makes it possible to provide for optimal melting and heating of substance including substance with low heat conduction. EFFECT: reduced energy capacity of process and device, specific metal quantity and labor input in unloading operations; and extended field of method and device application. 4 cl, 3 dwg
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Authors
Dates
2000-11-27—Published
1999-04-19—Filed