FIELD: instrumentation engineering; optical memory devices; data media. SUBSTANCE: process includes drying and melting of source polymer, melt compression in fixed disk-shaped mold incorporating data-carrying die, melt hardening during its cooling down, extraction of compact disk ingot from mold, evaporation of reflecting layer, coating of reflecting layer with shielding varnish, ultraviolet drying of varnish. Source polymer is dried out and conveyed with aid of oil- free compressor and ingot is cooled in mold. Deionized water delivered to mold and to evaporating device is used as cooling agent for evaporation of reflecting layer and for ingot cooling. Water resistance at mold inlet is to be between 10 and 15 Mohm, water temperature, between 11 and 13 C. Shielding layer is applied in the open by centrifuging method. Source polymer is polycarbonate. Precision control of pressure and temperature is made in the course of molding. Reflecting layer is evaporated in the environment of inert gas such as argon. Material for reflecting layer is metal such as aluminum or gold, or metal alloy. Composite cooling circuit connected to mold is used. EFFECT: reduced process time, improved quality of products, improved reliability and service life of device. 7 cl, 1 dwg
