METHOD OF FORMING RELIEF ON FUNCTIONAL LAYER SURFACE Russian patent published in 2001 - IPC

FIELD: microlithography, photolithography in particular. SUBSTANCE: proposed method consists in forming photoresistive layer on backing having thickness no less than maximum height of structures of relief formed on surface of functional layer. Then, photoresistive layer is subjected to exposure in accordance with preset program accompanied by development of exposed sections photoresist. Used as electromagnetic radiation source is laser radiation pulse generator at period of time required for removal of photoresist material exposed by one pulse from exposure zone in the course of development of latent image. After completion of development of latent image. After completion of development of photoresist material layer, relief surface of this layer is subjected to drying. Forming of relief on surface of functional layer of article is made simultaneously with forming this layer. EFFECT: enhanced efficiency and accuracy of forming required relief. 2 cl