PROCESS OF MANUFACTURE OF MICROCHIP UNIT BASED ON PHOTORESIST Russian patent published in 2003 - IPC

FIELD: microelectronics. SUBSTANCE: proposed process of manufacture of microchip unit based on photoresist foresees deposition of multilayer photoresist on substrate, microprofiling of relief of functional element in it and formation of leads for connection of microchip unit to outside network. Each layer of photoresist is deposited by lamination with the aid of rollers with subsequent lithography under effect of ultraviolet radiation. Lamination operation is conducted under conditions of controlled temperature of substrate and rollers kept on basis of start of photoresist softening between rollers and beginning of lamination in accordance with formula υ = 0,0028T±0,03, where v is lamination rate, m/min; T is temperature of rollers, C and duration of ultraviolet radiation during process of microprofiling is set in agreement with formula τ = 85/Φ±0,5, τ is radiation duration, s; Φ is luminous flux, cd. Sections of substrate at point of supply and collection of electric signals are metallized to form electric leads. EFFECT: raised reliability and accuracy in manufacture of microchip. 1 cl, 2 dwg, 2 tbl