FIELD: technology for manufacturing modules.
SUBSTANCE: in accordance to method for manufacturing a module to be built into body of card, on one of the sides of base 4,5,6 of this module current-conductive structure 7 is provided. During manufacture of module base at least its first layer 1, positioned on the lower side 9 directed from current-conductive structure 7, is made of material, properties of which, during mounting of module in the body of card in accordance to certain technology, have important value for aforementioned mounting, and are synchronized with properties of material of this layer of card body.
EFFECT: simplification and decreased costs of manufacturing technology.
3 cl, 3 dwg
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