ELECTROLYTE FOR DEPOSITION OF COPPER-THALLIUM ALLOY Russian patent published in 2001 - IPC

Abstract RU 2172361 C2

FIELD: electroplating; applicable in instrumentation engineering. SUBSTANCE: electrolyte contains, g/l: copper sulfate 20- 30; thallium sulfate 10-20; trilon B 40-50; aluminium sulfate 25-35; and water. EFFECT: produced quality coatings with increased corrosion resistance. 1 tbl

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RU 2 172 361 C2

Authors

Povetkin V.V.

Ivanova T.E.

Muslimova A.V.

Dates

2001-08-20—Published

1999-10-12—Filed