FIELD: monolithic and hybrid electronic devices. SUBSTANCE: device noted for high packing density of components and interconnections both when used separately and mounted in modular structure has heat-conducting substrate in the form of plate holding in its body active and passive components with contact pads. Active and passive components are disposed on both sides of substrate and form common planar surfaces for carrying connecting conductors deposited by using thin-film technology. It is monolithic device manufactured in a single process to obtain minimal quantity and minimal length of interconnections between both sides of device. At least one side of device carries flat external leads brought in direct contact with common output contact pads of device which are electrically connected to device components disposed either side of substrate by means of conductors arranged on substrate and at its edges. External leads and common output contact pads are electrically insulated from device components and conductors. Device substrate is made of insulating material or of conducting material covered with insulating layer. EFFECT: facilitated manufacture of monolithic and hybrid integrated circuits and interconnection of active and passive components, reduced cost of device. 4 dwg
