3D ELECTRONIC MODULE Russian patent published in 2008 - IPC H01L25/00 H01L23/34 H05K7/20 

FIELD: electrical engineering.

SUBSTANCE: 3D electronic module incorporating standard encased components and/or PCBs with caseless active and passive components, an outer heat sink system and outer output terminals. Note that encased components and the aforesaid PCBs feature double-side outputs arrangement and are located between the printed switching PCBs arranged in parallel and furnished with plated holes. The connecting PCB abuts, with its end face surfaces, on the aforesaid plated holes, the said connecting PCB having an electrical and mechanical connection to the switching PCBs. The switching PCB and the connecting PCB accommodates the 3D connectors, the latter being interconnected to form a cubic and/or tubular 3D cell made up of a set of 3D cells forming a plug-and-socket connection. The active element heat sink system represents a tubular 3D cell furnished with coaxially-arranged heat-sink lines wherein the active elements are in thermal contact with the pipe walls.

EFFECT: multi-purpose design, higher-density module featuring higher reparability and heat-sink properties.

19 dwg