FIELD: package control devices. SUBSTANCE: device has printed-circuit board abutting against edge 28 or bottom part 26 that forms bottom base member. High-power circuit components 14 are placed in vicinity of abutting point between printed- circuit board 10 and edge 28. Hold-down force is applied to high-power circuit component 14 or to printed-circuit board 10 by means of auxiliary fixture so as to ensure uniform pressure throughout entire abutting surface of printed-circuit board 10. For the purpose use may be made of spring members 30 or elastomer strip to hold down high-power circuit component 14. Provision is also made for using composite supporting members, respective plastic parts each acting directly upon printed-circuit board. EFFECT: improved heat transfer from circuit component through edge of bottom part. 12 cl, 7 dwg
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Authors
Dates
2002-06-20—Published
1996-12-20—Filed