DEVICE THAT HAS SUBSTRATE FOR HIGH-POWER COMPONENTS OF ELECTRIC CIRCUIT AND HEAT SINK, AS WELL AS METHOD FOR MANUFACTURING SUCH DEVICE Russian patent published in 2003 - IPC

FIELD: electronic engineering. SUBSTANCE: device has substrate and heat sink; one side of substrate carries at least one high-power circuit component on first large-area printed conductor and its side opposite to that carrying high-power circuit component mounts second large-area printed conductor connected through heat-conducting interlayers to first printed conductor; substrate is installed by its second side on heat sink to ensure heat-conduction contact between them In order to provide for effective heat transfer from substrate to heat sink and at the same time to avoid unwanted electric contact between live printed conductors substrate is proposed to be mounted on heat sink through taut struts disposed on its second side which keep this substrate at desired distance from heat sink; heat-conducting filler is introduced in substrate-to- heat-sink clearance whose width depends on mentioned distance. EFFECT: enhanced efficiency of heat transfer from substrate to heat sink; improved isolation of live printed conductors. 9 cl, 3 dwg