FIELD: electrical engineering, electronics. SUBSTANCE: technical result of invention lies in vocation of additional space for placement of certain number of high-power circuit elements with optimal usage of hookup area on printed circuit board and in provision of good removal of dissipated power to other heat drains thanks to thermal contact between partitions and framework. Given electric device which electron circuit incorporating high-power circuit elements 4 with individual system of heat removal is placed at least partially on printed circuit board 3. Framework 1 with certain number of partitions 6, 7 is provided for fixing electron circuit. Each partition is joined to proper wall of framework but is away from it. Heat- conductive parts of high-power circuit elements 4 are mated to them with provision for thermal contact. Framework 1 is linked to heat removing bottom part 2. EFFECT: potential for placement of additional number of high-power circuit elements. 5 cl, 1 dwg
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Authors
Dates
2002-08-10—Published
1996-11-22—Filed