FIELD: electrical engineering. SUBSTANCE: device incorporating thermal lag provision has case accommodating movable and fixed contacts and heat-sensing element and provided with heat-taking lid. Contacts are normally closed with fixed contact pressure applied to them. Heat-taking lid has extended thermalcontact surface; heat-sensing element is made of material possessing shape memory effect with preset straightforwardness and its configuration may be different, that is, it may be U- or S-shaped, or made in the form of closed or split ring. In addition case may be made in the form of cylinder with height-to-diameter ratio higher than 2. EFFECT: reduced size, enhanced operating stability. 5 cl, 1 dwg
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0 |
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SU1778814A1 | |
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Authors
Dates
2002-09-27—Published
2000-04-21—Filed