METHOD FOR ASSEMBLING HYBRID INTEGRATED CIRCUITS Russian patent published in 2008 - IPC H01L21/98 

FIELD: electronic engineering.

SUBSTANCE: proposed method for assembling hybrid integrated circuits includes coating of ceramic boards with solder paste to fix them on base and installation of ceramic boards onto base; for soldering passive and active components of integrated circuit on ceramic boards the latter are covered with solder paste, passive and active components are disposed on them, this being followed by fusing solder paste to attach ceramic boards to base and mentioned components, to ceramic boards, whereupon they are washed to remove remains of flux; after integrated-circuit semiconductor components in the form of chips are mounted on ceramic boards, jumpers are set apart on boards and chips.

EFFECT: reduced assembly time, consumption of flux and solder material, and labor consumption for their assembly.

1 cl, 11 dwg