METHOD OF THE THREE-DIMENSIONAL MULTI-CRYSTAL MODULE ON FLEXIBLE BOARD MANUFACTURING Russian patent published in 2018 - IPC H01L25/04 

FIELD: microelectronics.

SUBSTANCE: invention relates to microelectronics, in particular to the field of creating small-sized multi-crystal devices manufactured using the hybrid three-dimensional technology. In the three-dimensional multi-chip module manufacturing method, two mounting protrusions with contact pads, serving as the multi-crystal module terminals are symmetrically formed on the flexible board from two opposite edges. Along the flexible boards these same edges side projections are placed perpendicular to the central part, in pairs and coaxially, on which the microchips are mounted. Covering the flexible board both sides, with the exception of contact pads, with a continuous anticorrosive material. Performing the module three-dimensional assembly, sequentially laying the side projections on the flexible board central part coaxially one above the other and gluing with the sealant glue. Folding the flexible board central part, combining the microchips sides, without the module parts distortion relative to each other, wherein the flexible board mounting tabs are placed in the assembled three-dimensional multi-crystal module base from two opposite edges.

EFFECT: increase in the three-dimensional multi-crystal module reliability and expansion of its functionalities, flexible board protection against the mechanical and climatic influences during the module manufacturing and operation, improvement of the thermal mode and scalability by the used microcircuits number and type.

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