METHOD FOR MANUFACTURE OF SHF 3D MODULE Russian patent published in 2013 - IPC H01L25/04 

FIELD: electricity.

SUBSTANCE: method for manufacture of SHF 3D module includes fabrication of semiconductor structures at wafer, chipping of the wafer by end-to-end cutting with accuracy of at least ±10 mcm, chip purification and realignment, depositing of insulation layer through moving masks, vacuum setting of substrates and components in them, application of fixative solvent at joints of substrates and components, visual quality control of joints closure, vacuum deposition of conductors, removal of fixative solvent, scrubbing of micro IC cards, vacuum drying, burn-in testing and functional check of micro IC cards, their assembly into a stack, application of fixative solvent at joints between micro IC cards, vacuum deposition of conductors at the module edges, removal of fixative solvent, scrubbing of module, vacuum drying of the module, placement of the module into a prefabricated sheath, installation of primary outputs, filling of the sheath with powder, vibrocompaction, sealing, final check-up and packing of the module.

EFFECT: providing high density for electronic equipment with thermal performance excluding appearance of hot spots and high reliability factor.

8 cl, 9 dwg