METHOD FOR DEPOSITING CONDUCTORS ONTO SURFACES OF ELECTRONIC COMPONENTS Russian patent published in 2007 - IPC H01L21/60 

FIELD: production of electronic components.

SUBSTANCE: electronic components are disposed in special clamping device and oriented to butt-end surfaces. Clamping tool inserts have inclined slots to form end masks in the course of further deposition of conductors onto end surfaces of components. "Free" masks are fixed first on face side of components and then on their underside to provide for depositing conductors on face and underside surfaces of components; they have slits aligned with slots provided in clamping tool inserts. Conductors are deposited onto face and partially onto end surfaces , then onto underside surfaces of components, and once more onto their end surfaces by way of vacuum evaporation.

EFFECT: reduced cost and enhanced reliability of group method for depositing conductors onto surfaces of components in production of three-dimensional electronic modules, composite and two-way electronic devices.

6 cl, 4 dwg