FIELD: mechanical engineering; instrument-making industry; galvanization; deposition of the copper coatings on the steel without application of the intermediate sublayer.
SUBSTANCE: the invention is pertaining to galvanization, in particular, to deposition of the copper coatings on the steel without application of the sublayer and may be used in mechanical engineering and instrument-making industry for production of the bright copper coatings. The aqueous electrolyte contains: bluestone - 120-130 g; 70 % ethylene diamine - 115-125 g, sulfuric acid - 55-65 g; dihydrochloride β, β'-dipiperidineisopropyltret-butyl ether - 104-103 mole/l, water - up to 1 liter. The technical result of the invention is production of the qualitative nonporous galvanic deposits with the fine-crystalline structure, the specular surface, the good adhesion, without application of the intermediate layer.
EFFECT: the invention ensures production of the qualitative nonporous galvanic deposits with the fine-crystalline structure, the specular surface, the good adhesive power, without application of the intermediate layer.
3 tbl, 3 ex
| Title | Year | Author | Number |
|---|---|---|---|
| ELECTROLYTE FOR BRIGHT COPPER PLATING | 2002 |
|
RU2237754C2 |
| ELECTROLYTE FOR COPPER PLATING OF STEEL PARTS | 2002 |
|
RU2237755C2 |
| AQUEOUS BRIGHT COPPER PLATING ELECTROLYTE | 2002 |
|
RU2239008C2 |
| ELECTROLYTE FOR BRIGHTENED COPPER PLATING | 2001 |
|
RU2194097C1 |
| BRIGHT COPPER PLATING ELECTROLYTE | 2002 |
|
RU2215829C1 |
| AQUEOUS ELECTROLYTE FOR BRIGHT COPPER COATING OF STEEL BACKPLATES | 2004 |
|
RU2361969C2 |
| BRIGHT COPPER PLATING ELECTROLYTE | 1999 |
|
RU2179203C2 |
| ELECTROLYTE FOR BRIGHTENED COPPER PLATING | 2001 |
|
RU2194098C1 |
| AQUEOUS BRIGHT COPPER PLATING ELECTROLYTE FOR | 1999 |
|
RU2175999C2 |
| AQUEOUS ELECTROLYTE FOR BRIGHT COPPER PLATING | 2003 |
|
RU2323275C2 |
