FIELD: microelectronic technique. SUBSTANCE: invention concerns dielectric insulation of active elements of silicon of integrated microcircuits and creation of silicon-on-insulator structures with dielectric insulation. Glass for such structures is composed of (in wt % of oxide): silicon, 57-70; aluminium, 10-20; barium, 9-25; strontium, 1- 12; zirconium, 0.1-2; calcium, 1-6; and germanium, 1-6. Dielectric permittivity of glass at frequency 106 Hz is 8-9. EFFECT: improved insulation quality.
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Authors
Dates
1997-07-10—Published
1995-09-12—Filed