FIELD: microelectronic technique. SUBSTANCE: invention concerns dielectric insulation of active elements of silicon of integrated microcircuits and creation of silicon-on- insulator structures with dielectric insulation. Glass for such structures is composed of (in wt % of oxide): silicon, 46-59; aluminium, 20-23; barium, 16-18; strontium, 1-10; titanium, 0.01-8; cerium, 0.01-0.5; calcium, 1-6; and germanium, 1-8. Dielectric permittivity of glass at frequency 106 Hz is 7.5-8. EFFECT: improved insulation quality.
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Authors
Dates
1997-07-10—Published
1995-09-12—Filed