FIELD: microelectronic technique. SUBSTANCE: invention concerns dielectric insulation of active elements of silicon of integrated microcircuits and creation of silicon-on- insulator structures with dielectric insulation. Glass for such structures is composed of (in wt % of oxide): silicon, 46-59; aluminium, 20-23; barium, 16-18; strontium, 1-10; titanium, 0.01-8; cerium, 0.01-0.5; calcium, 1-6; and germanium, 1-8. Dielectric permittivity of glass at frequency 106 Hz is 7.5-8. EFFECT: improved insulation quality.
| Title | Year | Author | Number | 
|---|---|---|---|
| GLASS FOR STRUCTURES OF SILICON-ON-INSULATOR TYPE | 1995 | 
 | RU2083514C1 | 
| GLASS FOR GLASS CERAMIC CEMENT | 1994 | 
 | RU2069199C1 | 
| GLASS, MAINLY, FOR INSULATION OF ALUMINUM CONDUCTOR WIRING | 1992 | 
 | RU2036868C1 | 
| GLASS | 1995 | 
 | RU2081069C1 | 
| GLASSY INORGANIC DIELECTRIC | 2019 | 
 | RU2711609C1 | 
| METHOD OF MANUFACTURING SILICON STRUCTURE WITH DIELECTRIC INSULATION | 1992 | 
 | RU2018194C1 | 
| COMPOSITION OF EASILY FUSIBLE GLASS CERAMIC MATERIAL | 2000 | 
 | RU2197441C2 | 
| GLASS FOR INTEGRATED CIRUITS | 0 | 
 | SU1143702A1 | 
| GLASS FOR MAKING CRYSTALLINE GLASS CEMENT FOR INSULATING ELEMENTS OF INTEGRATED CIRCUITS | 0 | 
 | SU948921A1 | 
| COMPOSITION FOR MANUFACTURE OF GLASS-LIKE DIELECTRIC MATERIAL | 1995 | 
 | RU2096848C1 | 
Authors
Dates
1997-07-10—Published
1995-09-12—Filed