FIELD: electrical engineering, manufacturing technology of boards with integrated circuits. SUBSTANCE: process of manufacture of induction coil 20 for transponder includes separation of different turns 8 of induction coil in multilayer sheet incorporating at least one conductive layer 2, stamping of mentioned conductive layer with the help of punch making cuts 7 separating mentioned turns 8, connection of one electron component as minimum to mentioned turns 8. In compliance with invention mentioned conductive layer 2 is coated prior to stamping with surface film 3 intended to make stamping easier and at least one insulation material 9 is entered into above-mentioned cuts 7 to secure electric insulation of various conductive tracks. Invention also provides for manufacture of transponder by this process and card with integrated circuit. EFFECT: raised quality of induction coils of transponders with simultaneous simplification of their manufacturing technology. 27 cl, 8 dwg
