FIELD: electronic module manufacture. SUBSTANCE: process for manufacturing electronic modules (transponders and integrated-circuit cards) using printed-circuit boards 21 of insulating material 1 coated with one or more conducting surface metal layers 2, 2' includes stage of separating different conducting tracks 8 by mechanical treatment of slits 7 in mentioned conducting layer. Mechanical treatment is made by means of pointed cutting tool used to cut slits separating mentioned conducting tracks without removing conducting material and its displacement deep into slit, So, for cutting slits use can be made of die punch or cutting table with controlled knife. Process is also useful for manufacturing multilayer circuits and, in particular, flexible printed-circuit boards, connectors, and the like, as well as for manufacturing inductance coils 23 whose turns are formed by printed- circuit tracks, mentioned coils being useful, for example, in cards built around integrated circuits 20. EFFECT: facilitated procedure, enlarged functional capabilities. 14 cl, 10 dwg
