FIELD: computer engineering. SUBSTANCE: dynamic-memory cascaded integrated module is made in the form of flip-flop and has cascaded links of dynamic-memory integrated module and decoder; it also has cascaded input links of one dynamic-memory module built of two executable switches semiconductor incorporating one controlled-signal intermediate input bus, two controlled- signal intermediate input buses, two controlled-signal intermediate output buses, and two separate controlled-signal buses each being linked with one of mentioned executable semiconductor switches. Each of controlled-signal intermediate output buses of next dynamic-memory module in each cascaded link is connected to controlled-signal intermediate input bus of dynamic-memory module of next cascaded link, and executable semiconductor switches of output cascaded link are switched over to decoder. EFFECT: facilitated computer-aided design; enlarged functional capabilities. 1 cl, 5 dwg, 1 tbl
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