SOLDER FOR LOW-TEMPERATURE SOLDERING Russian patent published in 2003 - IPC

FIELD: soldering processes and devices, namely composition of tin-base solder used for leveling front surface of automobile bodies at condition of conveyer assembling automobiles and at repairing works. SUBSTANCE: composition of solder for low-temperature soldering containing tin, copper, zinc, antimony and nickel contains in addition iron, bismuth, cadmium, manganese, silver, silicon at next relation of ingredients, mass%: copper, 8 -20; zinc, up to 2.1; iron, 0.05 - 2.0; nickel, 0.1 - 1.0; antimony, 0.1 - 0.5; bismuth, up to 0.1; cadmium, up to 0.05; manganese, up to 0.05; silver, up to 0.05; silicon, up to 0.05; tin, the balance. Solder according to invention satisfies to demands for soldering onto vertical surfaces of articles of steels and non-ferrous alloys, particularly butt joints of automobile bodies with leveling their front surface, possibly in wide temperature interval 200 -240 C at soldering by means of gas torch. EFFECT: enhanced properties of solder suitable for soldering on vertical surfaces of automobile bodies. 1 tbl