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2 547 979

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(51)

IPC

B23K35/26(2006-01-01)

C22C11/06(2006-01-01)

(21) (22)

Application

2013155751/02, 2013-12-17

(24)

Start date

2013-12-17

(22)

Actual filing date

2013-12-17

(45)

Published

2015-04-10

(72)

Inventor

Kablov Evgenij NikolaevichLukin Vladimir IvanovichRyl'Nikov Vitalij SergeevichLisitskij Boris SerafimovichSolov'Eva Galina FedorovnaCherkasov Aleksej FilippovichAfanas'Ev-Khodykin Aleksandr Nikolaevich

(73)

Holder

Federal'Noe Gosudarstvennoe Unitarnoe Predprijatie Nauchno-Issledovatel'Skij Institut Aviatsionnykh Materialov"

LEAD BASED SOLDER Russian patent published in 2015 - IPC B23K35/26 C22C11/06

Abstract RU 2547979 C1

FIELD: metallurgy.

SUBSTANCE: solder contains components in the following content in wt %: 4.0-7.0 Sn; 0.5-2.0 In; 0.001-0.1 Cu; 0.2-1.0 Sb; 0.001-0.2 Na; 1.0-3.0 Bi; 0.1-0.5 Ni; 0.005-0.1 Ce; 0.001-0.3 Zn; Pb - rest.

EFFECT: increased strength at maximum operating temperature 250 degrees, increased corrosion resistance of soldered joints, decreased wastage during soldering.

3 tbl, 3 ex

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RU 2 547 979 C1

Authors

Kablov Evgenij Nikolaevich

Lukin Vladimir Ivanovich

Ryl'Nikov Vitalij Sergeevich

Lisitskij Boris Serafimovich

Solov'Eva Galina Fedorovna

Cherkasov Aleksej Filippovich

Afanas'Ev-Khodykin Aleksandr Nikolaevich

Dates

2015-04-10—Published

2013-12-17—Filed