SOLDER FOR SOLDERING ARTICLES AND METHOD OF PRODUCTION OF SOLDER Russian patent published in 1999 - IPC

FIELD: soldering of ferrous and nonferrous metals and hard alloys. SUBSTANCE: solder contains the following components, wt.%: copper, 40-50; manganese, 7-15; nickel, 1-3.4; tin, 2-6; aluminum, 0.01-1; boron, 0.05-0.5; zinc, the balance. Solder may contain at least one element selected from group including, %: silicon, 0.05-05; germanium, 0.02-0.5; iron, 0.5-1.0; cobalt, 0.05-1.5; zirconium, 0.01-0.1. Molten solder under pressure is supplied from feeder to cooled rotating drum. Solder flows over trough installed in hole of side surface of feeder. In this case, trough is located near drum at an angle of 5-60 deg to horizontal plane running through its axis of rotation. Drum is rotated at speed of 0.1-3.8 m/s. Crystallization is effected at the rate of 10³-10⁴ C/s. Produced strip of solder may be subjected to isothermal annealing at temperature of 450-650 C for 15-40 min. EFFECT: higher efficiency. 4 cl, 1 dwg, 2 tbl