PRINTED-CIRCUIT BOARD, ITS MANUFACTURING PROCESS, AND METHOD FOR READJUSTING ELECTRONIC ASSEMBLY ON PRINTED-CIRCUIT BOARD Russian patent published in 2004 - IPC

FIELD: electronic instrumentation engineering.

SUBSTANCE: proposed printed-circuit board characterized in unified mechanical design and manufactured to unified documentation in unified process for carrying printed electronic assemblies designed for operation under versatile conditions is, essentially, planar substrate having at least one seating place for separately packaged electronic plug-in component such as integrated-circuit of definite size provided with terminal strips arranged in line on at least one end of separate package. Line of printed conducting sections is formed on planar substrate in vicinity of seating place, their quantity being equal to that of terminal strips; each of them is used to secure respective terminal strip connected to printed conductors for connection to other electronic components disposed on wafer surface in compliance with schematic circuit diagram. Line of additional printed conducting sections meant for surface wiring and mounting terminal strips of other separately packaged electronic plug-in component of integrated-circuit type whose size differs from that of mentioned plug-in component is formed in parallel with line of printed conducting sections for securing terminal strips of plug-in component. Additional printed conducting sections are connected to printed conductors formed on planar substrate in compliance with schematic circuit diagram and circuit arrangement of first of mentioned electronic plug-in component; printed conducting sections of both electronic plug-in components having same circuit arrangement are interconnected.

EFFECT: enlarged functional capabilities.

6 cl, 4 dwg